Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10963415 | Bimodal PHY for low latency in high speed interconnects | Venkatraman Iyer, William R. Halleck, Eric M. Lee | 2021-03-30 |
| 10931329 | High speed interconnect with channel extension | William R. Halleck, Fulvio Spagna, Venkatraman Iyer | 2021-02-23 |