Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11080212 | High performance interconnect physical layer | Venkatraman Iyer, Jeff Willey, Robert G. Blankenship | 2021-08-03 | $25,424,000 |
| 10983920 | Customizable multi queue DMA interface | Chandrasekhar S. Thyamagondlu, Tao Yu, John West, Hanh Hoang, Ravi Sunkavalli | 2021-04-20 | $84,827,000 |
| 10909055 | High performance interconnect physical layer | Venkatraman Iyer, Robert G. Blankenship, Fulvio Spagna, Ashish Gupta | 2021-02-02 | $28,243,000 |