Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-11-23 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Anindya Poddar | 2021-11-23 |
| 11158567 | Package with stacked power stage and integrated control die | Woochan Kim, Benjamin A. Samples | 2021-10-26 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-10-26 |
| 11075147 | Stacked die semiconductor package | Woochan Kim, Ken Pham | 2021-07-27 |
| 11031332 | Package panel processing with integrated ceramic isolation | Woochan Kim, Benjamin A. Samples | 2021-06-08 |
| 10919929 | Glucocorticoid inhibitors for treatment of prostate cancer | Charles L. Sawyers, Michael J. Evans, Darren R. Veach | 2021-02-16 |