| 11183460 |
Embedded die packaging with integrated ceramic substrate |
Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar |
2021-11-23 |
| 11183441 |
Stress buffer layer in embedded package |
Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more |
2021-11-23 |
| 11158567 |
Package with stacked power stage and integrated control die |
Vivek Kishorechand Arora, Benjamin A. Samples |
2021-10-26 |
| 11158595 |
Embedded die package multichip module |
Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more |
2021-10-26 |
| 11075147 |
Stacked die semiconductor package |
Vivek Kishorechand Arora, Ken Pham |
2021-07-27 |
| 11032797 |
Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals and method for receiving broadcast signals |
Jaeho Hwang, Byounggill Kim, Jaehyung Kim, Sungryong Hong, Chulkyu Mun +4 more |
2021-06-08 |
| 11031332 |
Package panel processing with integrated ceramic isolation |
Benjamin A. Samples, Vivek Kishorechand Arora |
2021-06-08 |
| 10958378 |
Method for communication apparatus processing an in-band emission interference signal when the communication apparatus operating in FDR mode tranceives signals using FDM manner |
Dongkyu Kim, Sangrim Lee, Hojae Lee |
2021-03-23 |
| 10924314 |
Broadcast signal transmission apparatus, broadcast signal reception apparatus, broadcast signal transmission method, and broadcast signal reception method |
Jongseob Baek, Byounggill Kim, Jaehyung Kim, Woosuk KO, Sungryong Hong +5 more |
2021-02-16 |
