Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183460 | Embedded die packaging with integrated ceramic substrate | Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2021-11-23 |
| 11183441 | Stress buffer layer in embedded package | Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-11-23 |
| 11158567 | Package with stacked power stage and integrated control die | Vivek Kishorechand Arora, Benjamin A. Samples | 2021-10-26 |
| 11158595 | Embedded die package multichip module | Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-10-26 |
| 11075147 | Stacked die semiconductor package | Vivek Kishorechand Arora, Ken Pham | 2021-07-27 |
| 11032797 | Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals and method for receiving broadcast signals | Jaeho Hwang, Byounggill Kim, Jaehyung Kim, Sungryong Hong, Chulkyu Mun +4 more | 2021-06-08 |
| 11031332 | Package panel processing with integrated ceramic isolation | Benjamin A. Samples, Vivek Kishorechand Arora | 2021-06-08 |
| 10958378 | Method for communication apparatus processing an in-band emission interference signal when the communication apparatus operating in FDR mode tranceives signals using FDM manner | Dongkyu Kim, Sangrim Lee, Hojae Lee | 2021-03-23 |
| 10924314 | Broadcast signal transmission apparatus, broadcast signal reception apparatus, broadcast signal transmission method, and broadcast signal reception method | Jongseob Baek, Byounggill Kim, Jaehyung Kim, Woosuk KO, Sungryong Hong +5 more | 2021-02-16 |