Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-11-23 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora | 2021-11-23 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-10-26 |
| 11021786 | Copper passivation | Luu Thanh Nguyen, Mahmud Halim Chowdhury, Ashok S. Prabhu | 2021-06-01 |