Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Daniel Lee Revier, Sadia Naseem | 2021-06-08 |
| 11021786 | Copper passivation | Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar | 2021-06-01 |