Issued Patents 2021
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195811 | Dielectric and metallic nanowire bond layers | Scott R. Summerfelt, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2021-12-07 |
| 11159204 | Backplane with near field coupling to modules | Mark W. Morgan, Swaminathan Sankaran, Ali Djabbari, Lutz Naumann | 2021-10-26 |
| 11145598 | Lattice bump interconnect | Nazila Dadvand, Archana Venugopal, Luigi Colombo | 2021-10-12 |
| 11133375 | Semiconductor substrate with integrated inductive component | Roberto Giampiero Massolini, Daniel N. Carothers | 2021-09-28 |
| 11128023 | Substrate design for efficient coupling between a package and a dielectric waveguide | Hassan Ali, Juan Alejandro Herbsommer, Vikas Gupta, Athena Lin, Swaminathan Sankaran | 2021-09-21 |
| 11128345 | Contactless interface for mm-wave near field communication | Swaminathan Sankaran | 2021-09-21 |
| 11105681 | Spectroscopy cavity with digital activation of millimeter wave molecular headspace | Adam Joseph Fruehling, Simon Joshua Jacobs, Juan Alejandro Herbsommer | 2021-08-31 |
| 11063120 | Metal-graphene structures forming a lattice of interconnected segments | Luigi Colombo, Archana Venugopal, Nazila Dadvand | 2021-07-13 |
| 11049980 | Integrated MIM diode | Scott R. Summerfelt | 2021-06-29 |
| 11049836 | Bond wire support systems and methods | Matthew David Romig | 2021-06-29 |
| 11031364 | Nanoparticle backside die adhesion layer | Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury | 2021-06-08 |
| 11011815 | Circularly-polarized dielectric waveguide launch for millimeter-wave data communication | Hassan Ali, Juan Alejandro Herbsommer, Swaminathan Sankaran | 2021-05-18 |
| 11004680 | Semiconductor device package thermal conduit | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2021-05-11 |
| 10985729 | BAW resonator based pressure sensor | Bichoy Bahr, Baher Haroun | 2021-04-20 |
| 10969746 | Magnetically compensated chip scale atomic clock | Bradley Allen Kramer, Juan Alejandro Herbsommer | 2021-04-06 |
| 10957635 | Multi-chip package with high thermal conductivity die attach | Nazila Dadvand, Sreenivasan K. Koduri | 2021-03-23 |
| 10923457 | Multi-die module with contactless coupler and a coupling loss reduction structure | Bichoy Bahr, Baher Haroun | 2021-02-16 |
| 10913654 | Packaging a sealed cavity in an electronic device | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, James F. Hallas, Randy Long | 2021-02-09 |
| 10910465 | 3D printed semiconductor package | Daniel Lee Revier | 2021-02-02 |
| 10908414 | Lens cleaning via electrowetting | Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan | 2021-02-02 |
| 10892209 | Semiconductor device with metal die attach to substrate with multi-size cavity | Nazila Dadvand, Sreenivasan K. Koduri | 2021-01-12 |
| 10886187 | Thermal management in integrated circuit using phononic bandgap structure | Daniel Lee Revier | 2021-01-05 |