| 11195811 |
Dielectric and metallic nanowire bond layers |
Scott R. Summerfelt, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri |
2021-12-07 |
| 11159204 |
Backplane with near field coupling to modules |
Mark W. Morgan, Swaminathan Sankaran, Ali Djabbari, Lutz Naumann |
2021-10-26 |
| 11145598 |
Lattice bump interconnect |
Nazila Dadvand, Archana Venugopal, Luigi Colombo |
2021-10-12 |
| 11133375 |
Semiconductor substrate with integrated inductive component |
Roberto Giampiero Massolini, Daniel N. Carothers |
2021-09-28 |
| 11128023 |
Substrate design for efficient coupling between a package and a dielectric waveguide |
Hassan Ali, Juan Alejandro Herbsommer, Vikas Gupta, Athena Lin, Swaminathan Sankaran |
2021-09-21 |
| 11128345 |
Contactless interface for mm-wave near field communication |
Swaminathan Sankaran |
2021-09-21 |
| 11105681 |
Spectroscopy cavity with digital activation of millimeter wave molecular headspace |
Adam Joseph Fruehling, Simon Joshua Jacobs, Juan Alejandro Herbsommer |
2021-08-31 |
| 11063120 |
Metal-graphene structures forming a lattice of interconnected segments |
Luigi Colombo, Archana Venugopal, Nazila Dadvand |
2021-07-13 |
| 11049980 |
Integrated MIM diode |
Scott R. Summerfelt |
2021-06-29 |
| 11049836 |
Bond wire support systems and methods |
Matthew David Romig |
2021-06-29 |
| 11031364 |
Nanoparticle backside die adhesion layer |
Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury |
2021-06-08 |
| 11011815 |
Circularly-polarized dielectric waveguide launch for millimeter-wave data communication |
Hassan Ali, Juan Alejandro Herbsommer, Swaminathan Sankaran |
2021-05-18 |
| 11004680 |
Semiconductor device package thermal conduit |
Archana Venugopal, Luigi Colombo, Robert Reid Doering |
2021-05-11 |
| 10985729 |
BAW resonator based pressure sensor |
Bichoy Bahr, Baher Haroun |
2021-04-20 |
| 10969746 |
Magnetically compensated chip scale atomic clock |
Bradley Allen Kramer, Juan Alejandro Herbsommer |
2021-04-06 |
| 10957635 |
Multi-chip package with high thermal conductivity die attach |
Nazila Dadvand, Sreenivasan K. Koduri |
2021-03-23 |
| 10923457 |
Multi-die module with contactless coupler and a coupling loss reduction structure |
Bichoy Bahr, Baher Haroun |
2021-02-16 |
| 10913654 |
Packaging a sealed cavity in an electronic device |
Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, James F. Hallas, Randy Long |
2021-02-09 |
| 10910465 |
3D printed semiconductor package |
Daniel Lee Revier |
2021-02-02 |
| 10908414 |
Lens cleaning via electrowetting |
Daniel Lee Revier, David Patrick Magee, Stephen John Fedigan |
2021-02-02 |
| 10892209 |
Semiconductor device with metal die attach to substrate with multi-size cavity |
Nazila Dadvand, Sreenivasan K. Koduri |
2021-01-12 |
| 10886187 |
Thermal management in integrated circuit using phononic bandgap structure |
Daniel Lee Revier |
2021-01-05 |