Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury | 2021-06-08 |
| 10908414 | Lens cleaning via electrowetting | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2021-02-02 |
| 10910465 | 3D printed semiconductor package | Benjamin Stassen Cook | 2021-02-02 |
| 10886187 | Thermal management in integrated circuit using phononic bandgap structure | Benjamin Stassen Cook | 2021-01-05 |