Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury | 2021-06-08 | $50,580,000 |
| 10908414 | Lens cleaning via electrowetting | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2021-02-02 | $39,672,000 |
| 10910465 | 3D printed semiconductor package | Benjamin Stassen Cook | 2021-02-02 | $39,672,000 |
| 10886187 | Thermal management in integrated circuit using phononic bandgap structure | Benjamin Stassen Cook | 2021-01-05 | $41,850,000 |