Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Daniel Lee Revier, Mahmud Halim Chowdhury | 2021-06-08 |
| 10916448 | Method for creating a wettable surface for improved reliability in QFN packages | Vikas Gupta | 2021-02-09 |