Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11128023 | Substrate design for efficient coupling between a package and a dielectric waveguide | Hassan Ali, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Athena Lin, Swaminathan Sankaran | 2021-09-21 | $75,664,000 |
| 11062982 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2021-07-13 | $42,316,000 |
| 11018111 | Wafer level derived flip chip package | Rongwei Zhang, James R. Huckabee | 2021-05-25 | $87,337,000 |
| 10916448 | Method for creating a wettable surface for improved reliability in QFN packages | Sadia Naseem | 2021-02-09 | $69,731,000 |
| 10910705 | Antenna in package device having substrate stack | Athena Lin, Juan Alejandro Herbsommer | 2021-02-02 | $39,672,000 |
| 10883953 | Semiconductor device for sensing impedance changes in a medium | Enis Tuncer | 2021-01-05 | $41,850,000 |