Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018111 | Wafer level derived flip chip package | James R. Huckabee, Vikas Gupta | 2021-05-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018111 | Wafer level derived flip chip package | James R. Huckabee, Vikas Gupta | 2021-05-25 |