Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11128023 | Substrate design for efficient coupling between a package and a dielectric waveguide | Hassan Ali, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Vikas Gupta, Swaminathan Sankaran | 2021-09-21 | $75,664,000 |
| 10910705 | Antenna in package device having substrate stack | Vikas Gupta, Juan Alejandro Herbsommer | 2021-02-02 | $39,672,000 |