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Lattice bump interconnect |
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Nanostructure barrier for copper wire bonding |
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Semiconductor die with conversion coating |
Christopher Daniel Manack |
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Nickel lanthanide alloys for MEMS packaging applications |
Kathryn Ann Schuck |
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| 11094616 |
Multi-pitch leads |
Sreenivasan K. Koduri |
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| 11063120 |
Metal-graphene structures forming a lattice of interconnected segments |
Luigi Colombo, Archana Venugopal, Benjamin Stassen Cook |
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Zinc-cobalt barrier for interface in solder bond applications |
Christopher Daniel Manack, Salvatore Frank Pavone |
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Nickel alloy for semiconductor packaging |
Christopher Daniel Manack, Salvatore Frank Pavone |
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| 10957637 |
Quad flat no-lead package with wettable flanges |
— |
2021-03-23 |
| 10957635 |
Multi-chip package with high thermal conductivity die attach |
Sreenivasan K. Koduri, Benjamin Stassen Cook |
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| 10892209 |
Semiconductor device with metal die attach to substrate with multi-size cavity |
Benjamin Stassen Cook, Sreenivasan K. Koduri |
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