Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145598 | Lattice bump interconnect | Benjamin Stassen Cook, Nazila Dadvand, Luigi Colombo | 2021-10-12 |
| 11081593 | Integration of graphene and boron nitride hetero-structure device | Luigi Colombo | 2021-08-03 |
| 11063120 | Metal-graphene structures forming a lattice of interconnected segments | Luigi Colombo, Benjamin Stassen Cook, Nazila Dadvand | 2021-07-13 |
| 11004680 | Semiconductor device package thermal conduit | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2021-05-11 |
| 10923567 | Graphene FET with graphitic interface layer at contacts | Luigi Colombo | 2021-02-16 |