Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11127515 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Salvatore Frank Pavone | 2021-09-21 | $75,664,000 |
| 11121076 | Semiconductor die with conversion coating | Nazila Dadvand | 2021-09-14 | $36,977,000 |
| 11011483 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 | $32,944,000 |
| 11011488 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 | $32,944,000 |