Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127515 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Salvatore Frank Pavone | 2021-09-21 |
| 11121076 | Semiconductor die with conversion coating | Nazila Dadvand | 2021-09-14 |
| 11011483 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 |
| 11011488 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 |