Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Nanostructure barrier for copper wire bonding

Nanostructure barrier for copper wire bonding

US Patent 11127515 · Granted Sep 21, 2021

Estimated economic value: $75,664,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Laser ablation for die separation to reduce laser splash and electronic device2025
Electronic device with post mold plated nickel tungsten and tin bilayer for impr2025
Efficient removal of street test devices during wafer dicing2025
Neutral pH copper plating solution for undercut reduction2025
Electronic devices in semiconductor package cavities2025
Contact with bronze material to mitigate undercut2025
Contact with bronze material to mitigate undercut2025
Contact with bronze material to mitigate undercut2025
Miniature sensor cavities2025
Chemically anchored mold compounds in semiconductor packages2024
Semiconductor package with nickel-silver pre-plated leadframe2024
Filler particles for polymers2024