Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemically anchored mold compounds in semiconductor packages

Chemically anchored mold compounds in semiconductor packages

US Patent 12180595 · Granted Dec 31, 2024

Estimated economic value: $31,735,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device with post mold plated nickel tungsten and tin bilayer for impr2025
Neutral pH copper plating solution for undercut reduction2025
Contact with bronze material to mitigate undercut2025
Semiconductor package with nickel-silver pre-plated leadframe2024
Filler particles for polymers2024
Die attach surface copper layer with protective layer for microelectronic device2024
Plating for thermal management2024
Method of forming brass-coated metals in flip-chip redistribution layers2024
SP2-bonded carbon structures2024
Quad flat no-lead package with wettable flanges2024
Semiconductor device with metal die attach to substrate with multi-size cavity2024
Thermally conductive wafer layer2023