Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11082028 | 3D-printed protective shell structures with support columns for stress sensitive circuits | James Cooper Wainerdi, Luu Thanh Nguyen, Alexander Harvey Scheuermann | 2021-08-03 |
| 11061384 | Methods, apparatus, and systems to facilitate multi-channel isolation | Mayank Garg | 2021-07-13 |
| 11049836 | Bond wire support systems and methods | Benjamin Stassen Cook | 2021-06-29 |