Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11082028 | 3D-printed protective shell structures with support columns for stress sensitive circuits | James Cooper Wainerdi, Alexander Harvey Scheuermann, Matthew David Romig | 2021-08-03 |
| 11031311 | Packaged semiconductor device with multilayer stress buffer | — | 2021-06-08 |
| 11021786 | Copper passivation | Mahmud Halim Chowdhury, Ashok S. Prabhu, Anindya Poddar | 2021-06-01 |