Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158567 | Package with stacked power stage and integrated control die | Woochan Kim, Vivek Kishorechand Arora | 2021-10-26 |
| 11031332 | Package panel processing with integrated ceramic isolation | Woochan Kim, Vivek Kishorechand Arora | 2021-06-08 |