Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11171239 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Christopher J. Jezewski, Urusa Alaan, Justin R. Weber | 2021-11-09 |
| 11164809 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Christopher J. Jezewski +1 more | 2021-11-02 |
| 11139241 | Integrated circuit device with crenellated metal trace layout | Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar | 2021-10-05 |
| 11139300 | Three-dimensional memory arrays with layer selector transistors | Wilfred Gomes, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more | 2021-10-05 |
| 11087832 | Three-dimensional nanoribbon-based static random-access memory | Wilfred Gomes, Kinyip Phoa, Tahir Ghani | 2021-08-10 |
| 11062995 | Interconnect fabricated with flowable copper | Carl Naylor | 2021-07-13 |
| 11056492 | Dense memory arrays utilizing access transistors with back-side contacts | Wilfred Gomes, Elliot N. Tan, Szuya S. Liao, Tahir Ghani, Swaminathan Sivakumar +1 more | 2021-07-06 |
| 11056356 | Fluid viscosity control during wafer bonding | Brennen Mueller, Daniel Pantuso, Chytra Pawashe, Myra McDonnell | 2021-07-06 |
| 10892337 | Backside source/drain replacement for semiconductor devices with metallization on both sides | Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Patrick Morrow | 2021-01-12 |
| 10886217 | Integrated circuit device with back-side interconnection to deep source/drain semiconductor | Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru | 2021-01-05 |