| 11189585 |
Selective recess of interconnects for probing hybrid bond devices |
Brennen Mueller, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Pooya Tadayon |
2021-11-30 |
$30,212,000 |
| 11171239 |
Transistor channel passivation with 2D crystalline material |
Carl Naylor, Abhishek A. Sharma, Christopher J. Jezewski, Urusa Alaan, Justin R. Weber |
2021-11-09 |
$28,241,000 |
| 11164809 |
Integrated circuits and methods for forming integrated circuits |
Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Christopher J. Jezewski +1 more |
2021-11-02 |
$26,002,000 |
| 11139241 |
Integrated circuit device with crenellated metal trace layout |
Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2021-10-05 |
$23,463,000 |
| 11139300 |
Three-dimensional memory arrays with layer selector transistors |
Wilfred Gomes, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more |
2021-10-05 |
$23,463,000 |
| 11087832 |
Three-dimensional nanoribbon-based static random-access memory |
Wilfred Gomes, Kinyip Phoa, Tahir Ghani |
2021-08-10 |
$36,027,000 |
| 11062995 |
Interconnect fabricated with flowable copper |
Carl Naylor |
2021-07-13 |
$34,958,000 |
| 11056492 |
Dense memory arrays utilizing access transistors with back-side contacts |
Wilfred Gomes, Elliot N. Tan, Szuya S. Liao, Tahir Ghani, Swaminathan Sivakumar +1 more |
2021-07-06 |
$31,309,000 |
| 11056356 |
Fluid viscosity control during wafer bonding |
Brennen Mueller, Daniel Pantuso, Chytra Pawashe, Myra McDonnell |
2021-07-06 |
$31,309,000 |
| 10892337 |
Backside source/drain replacement for semiconductor devices with metallization on both sides |
Glenn A. Glass, Karthik Jambunathan, Anand S. Murthy, Chandra S. Mohapatra, Patrick Morrow |
2021-01-12 |
$55,416,000 |
| 10886217 |
Integrated circuit device with back-side interconnection to deep source/drain semiconductor |
Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru |
2021-01-05 |
$27,050,000 |
