Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195924 | Broken bandgap contact | Benjamin Chu-Kung, Van H. Le, Jack T. Kavalieros, Willy Rachmady, Matthew V. Metz +1 more | 2021-12-07 |
| 11164785 | Three-dimensional integrated circuits (3DICs) including upper-level transistors with epitaxial source and drain material | Gilbert Dewey, Cheng-Ying Huang, Willy Rachmady, Anand S. Murthy, Ryan Keech +1 more | 2021-11-02 |
| 11164809 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky, Christopher J. Jezewski +1 more | 2021-11-02 |
| 11152290 | Wide bandgap group IV subfin to reduce leakage | Benjamin Chu-Kung, Van H. Le, Willy Rachmady, Matthew V. Metz, Jack T. Kavalieros +1 more | 2021-10-19 |
| 11031499 | Germanium transistor structure with underlap tip to reduce gate induced barrier lowering/short channel effect while minimizing impact on drive current | Willy Rachmady, Van H. Le, Matthew V. Metz, Benjamin Chu-Kung, Jack T. Kavalieros | 2021-06-08 |
| 11024713 | Gradient doping to lower leakage in low band gap material devices | Seung Hoon Sung, Dipanjan Basu, Glenn A. Glass, Harold W. Kennel, Benjamin Chu-Kung +3 more | 2021-06-01 |
| 10998270 | Local interconnect for group IV source/drain regions | Seung Hoon Sung, Glenn A. Glass, Van H. Le, Benjamin Chu-Kung, Anand S. Murthy +1 more | 2021-05-04 |
| 10985263 | Thin film cap to lower leakage in low band gap material devices | Seung Hoon Sung, Dipanjan Basu, Van H. Le, Benjamin Chu-Kung, Harold W. Kennel +4 more | 2021-04-20 |