Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205586 | Integrated circuits with line breaks and line bridges within a single interconnect level | Kevin Lin | 2021-12-21 |
| 11201114 | Methods of forming thin film resistor structures utilizing interconnect liner materials | Kevin Lin, Richard Vreeland, Tristan A. Tronic | 2021-12-14 |
| 11171239 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Mauro J. Kobrinsky, Urusa Alaan, Justin R. Weber | 2021-11-09 |
| 11164809 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more | 2021-11-02 |
| 11094587 | Use of noble metals in the formation of conductive connectors | Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Flavio Griggio, Ramanan V. Chebiam +1 more | 2021-08-17 |
| 10937689 | Self-aligned hard masks with converted liners | Manish Chandhok, Satyarth Suri, Tristan A. Tronic, Richard E. Schenker | 2021-03-02 |