Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158515 | Selective metal removal for conductive interconnects in integrated circuitry | Kevin Lin, Rahim Kasim, Florian Gstrein | 2021-10-26 |
| 11152254 | Pitch quartered three-dimensional air gaps | Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak, Tristan A. Tronic +3 more | 2021-10-19 |
| 11011463 | Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom | Kevin Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani | 2021-05-18 |
| 10971394 | Maskless air gap to prevent via punch through | Todd R. Younkin, Eungnak Han, Jasmeet S. Chawla, Marie Krysak, Hui Jae Yoo +1 more | 2021-04-06 |
| 10937689 | Self-aligned hard masks with converted liners | Satyarth Suri, Tristan A. Tronic, Christopher J. Jezewski, Richard E. Schenker | 2021-03-02 |
| 10916499 | Vias and gaps in semiconductor interconnects | Kevin Lin | 2021-02-09 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2021-01-12 |
| 10886175 | Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom | Eungnak Han, Rami Hourani, Florian Gstrein, Gurpreet Singh, Scott B. Clendenning +1 more | 2021-01-05 |