Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094587 | Use of noble metals in the formation of conductive connectors | Christopher J. Jezewski, Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Ramanan V. Chebiam +1 more | 2021-08-17 |
| 11018054 | Integrated circuit interconnects | Daniel J. Zierath, John D. Brooks | 2021-05-25 |
| 10903114 | Decoupled via fill | Yuriy V. Shusterman, Tejaswi K. Indukuri, Ruth A. Brain | 2021-01-26 |