Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211324 | Via contact patterning method to increase edge placement error margin | Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more | 2021-12-28 |
| 11171043 | Plug and trench architectures for integrated circuits and methods of manufacture | Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Mohit K. HARAN, Alexander F. Kaplan | 2021-11-09 |
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Debashish Basu +1 more | 2021-10-12 |
| 11068640 | Power shared cell architecture | Ranjith Kumar, Mark Bohr, Marni Nabors, Tai-Hsuan Wu, Sourav Chakravarty | 2021-07-20 |
| 10943817 | Etch-stop layer topography for advanced integrated circuit structure fabrication | Andrew W. Yeoh, Michael L. Hattendorf, Christopher P. Auth | 2021-03-09 |
| 10903114 | Decoupled via fill | Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri | 2021-01-26 |