Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211324 | Via contact patterning method to increase edge placement error margin | Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An, Debashish Basu +6 more | 2021-12-28 |
| 11171043 | Plug and trench architectures for integrated circuits and methods of manufacture | Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Alexander F. Kaplan, Ruth A. Brain | 2021-11-09 |
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Debashish Basu, Curtis W. Ward +1 more | 2021-10-12 |