Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Debashish Basu +1 more | 2021-10-12 |
| 11063133 | Fin cut and fin trim isolation for advanced integrated circuit structure fabrication | Tahir Ghani, Byron Ho, Michael L. Hattendorf, Christopher P. Auth | 2021-07-13 |
| 10930753 | Trench isolation for advanced integrated circuit structure fabrication | Michael L. Hattendorf, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth | 2021-02-23 |
| 10892223 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more | 2021-01-12 |