Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211324 | Via contact patterning method to increase edge placement error margin | Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more | 2021-12-28 |
| 11145541 | Conductive via and metal line end fabrication and structures resulting therefrom | Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Curtis W. Ward +1 more | 2021-10-12 |