Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
MH

Michael L. Hattendorf

INIntel: 12 patents #123 of 5,160Top 3%
Portland, OR: #63 of 1,855 inventorsTop 4%
Oregon: #104 of 4,388 inventorsTop 3%
Overall (2021): #5,513 of 548,734Top 2%
12 Patents 2021

Issued Patents 2021

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11183432 Integrated circuits with recessed gate electrodes Srijit Mukherjee, Christopher J. Wiegand, Tyler J. Weeks, Mark Liu 2021-11-23
11127841 Confined epitaxial regions for semiconductor devices and methods of fabricating semiconductor devices having confined epitaxial regions Szuya S. Liao, Tahir Ghani 2021-09-21
11088261 Trench contact structures for advanced integrated circuit structure fabrication Subhash M. Joshi, Jeffrey S. Leib 2021-08-10
11063133 Fin cut and fin trim isolation for advanced integrated circuit structure fabrication Tahir Ghani, Byron Ho, Curtis W. Ward, Christopher P. Auth 2021-07-13
11031487 Contact over active gate structures for advanced integrated circuit structure fabrication Andrew W. Yeoh, Tahir Ghani, Atul MADHAVAN, Christopher P. Auth 2021-06-08
11011616 Gate line plug structures for advanced integrated circuit structure fabrication Byron Ho, Christopher P. Auth 2021-05-18
10985267 Fin trim isolation with single gate spacing for advanced integrated circuit structure fabrication Tahir Ghani, Byron Ho, Christopher P. Auth 2021-04-20
10964800 Semiconductor device having fin-end stress-inducing features Byron Ho, Jeanne Luce, Ebony L. Mays, Erica J. Thompson 2021-03-30
10957782 Trench contact structures for advanced integrated circuit structure fabrication Subhash M. Joshi, Jeffrey S. Leib 2021-03-23
10943817 Etch-stop layer topography for advanced integrated circuit structure fabrication Andrew W. Yeoh, Ruth A. Brain, Christopher P. Auth 2021-03-09
10930753 Trench isolation for advanced integrated circuit structure fabrication Curtis W. Ward, Heidi M. Meyer, Tahir Ghani, Christopher P. Auth 2021-02-23
10886383 Replacement gate structures for advanced integrated circuit structure fabrication Byron Ho, Steven Jaloviar, Jeffrey S. Leib, Christopher P. Auth 2021-01-05