Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195719 | Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer | Daniel Pantuso | 2021-12-07 | $28,128,000 |
| 11171057 | Semiconductor fin design to mitigate fin collapse | Glenn A. Glass, Anand S. Murthy, Daniel Pantuso, Tahir Ghani | 2021-11-09 | $28,241,000 |
| 11056356 | Fluid viscosity control during wafer bonding | Brennen Mueller, Daniel Pantuso, Mauro J. Kobrinsky, Myra McDonnell | 2021-07-06 | $31,309,000 |
| 10886153 | Display including an LED element having a pressure sensitive adhesive (PSA) for micro pick and bond assembly of the display | Peter L. D. Chang, Michael C. Mayberry, Jia-Hung Tseng | 2021-01-05 | $27,050,000 |