Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11195719 | Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer | Chytra Pawashe | 2021-12-07 | $28,128,000 |
| 11171057 | Semiconductor fin design to mitigate fin collapse | Glenn A. Glass, Chytra Pawashe, Anand S. Murthy, Tahir Ghani | 2021-11-09 | $28,241,000 |
| 11056356 | Fluid viscosity control during wafer bonding | Brennen Mueller, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell | 2021-07-06 | $31,309,000 |