Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Cross talk and interference reduction for high frequency wireless interconnects

Cross talk and interference reduction for high frequency wireless interconnects

US Patent 10992021 · Granted Apr 27, 2021

Estimated economic value: $44,593,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Fine-grained disaggregated server architecture2025
High precision scalable packaging architecture based on radio frequency scanning2025