Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11158578 | High density interconnect device and method | Mathew J. Manusharow | 2021-10-26 | $21,268,000 |
| 10998120 | Method of making an inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2021-05-04 | $37,420,000 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 | $36,336,000 |