Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158578 | High density interconnect device and method | Mihir K. Roy | 2021-10-26 |
| 10998120 | Method of making an inductor | William J. Lambert, Mihir K. Roy, Yikang Deng | 2021-05-04 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10886228 | Improving size and efficiency of dies | Jonathan Rosenfeld | 2021-01-05 |