Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda | 2021-11-23 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong | 2021-06-29 |