Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Ofir Degani +2 more | 2021-12-28 |
| 11132485 | Efficient integrated circuit simulation and testing | Evelyn Landman, Yair Talker, Yahel DAVID, Shai Cohen, Inbar WEINTROB | 2021-09-28 |