Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip package and method of providing die-to-die interconnects in same

Multi-chip package and method of providing die-to-die interconnects in same

US Patent 10923429 · Granted Feb 16, 2021

Estimated economic value: $35,223,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Data storage device and method for hybrid space balancing based on host read aff2025
Glass substrates having transverse capacitors for use with semiconductor package2025