Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112841 | 5G mmWave cooling through PCB | Divya Mani, William J. Lambert, Shawna M. Liff, Robert L. Sankman | 2021-09-07 |
| 11004768 | Multi-chip package with partial integrated heat spreader | Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sachin Deshmukh, Aravindha R. Antoniswamy +1 more | 2021-05-11 |