Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004768 | Multi-chip package with partial integrated heat spreader | Muhammad Saiful Islam, Enisa Harris, Suzana Prstic, Sergio Antonio Chan Arguedas, Sachin Deshmukh +1 more | 2021-05-11 |
| 10969840 | Heat spreaders with interlocked inserts | Syadwad Jain, Zhizhong Tang, Wei Hu | 2021-04-06 |