Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2021-07-13 | $34,958,000 |
| 10969840 | Heat spreaders with interlocked inserts | Aravindha R. Antoniswamy, Zhizhong Tang, Wei Hu | 2021-04-06 | $36,336,000 |