Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar | 2021-07-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar | 2021-07-13 |