Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11048841 | System, method and associated computer readable medium for designing integrated circuit with pre-layout RC information | Chin-Sheng Chen, Ching-Yu Chai | 2021-06-29 |
| 10969840 | Heat spreaders with interlocked inserts | Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang | 2021-04-06 |