Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez | 2021-08-24 |
| 10943884 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung | 2021-03-09 |