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Inorganic-based embedded-die layers for modular semiconductive devices |
Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman |
2021-11-02 |
| 11127682 |
Semiconductor package having nonspherical filler particles |
Sashi S. Kandanur, David Unruh |
2021-09-21 |
| 11107781 |
RFIC having coaxial interconnect and molded layer |
Rahul N. Manepalli, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing |
2021-08-31 |
| 11101222 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim |
2021-08-24 |
| 11081448 |
Embedded die microelectronic device with molded component |
Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2021-08-03 |
| 11037802 |
Package substrate having copper alloy sputter seed layer and high density interconnects |
Robert Alan May, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Sandeep Gaan |
2021-06-15 |
| 11031360 |
Techniques for an inductor at a second level interface |
Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Ying Wang +3 more |
2021-06-08 |
| 10998282 |
Surface finishes for high density interconnect architectures |
David Unruh |
2021-05-04 |
| 10897008 |
Magnetoresistive stacks with an unpinned, fixed synthetic anti-ferromagnetic structure and methods of manufacturing thereof |
Bengt J. Akerman, Renu Whig, Jason Janesky, Nicholas Rizzo, Jon Slaughter |
2021-01-19 |
| 10892219 |
Molded embedded bridge for enhanced EMIB applications |
Rahul N. Manepalli |
2021-01-12 |