Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2021-11-02 |
| 11127682 | Semiconductor package having nonspherical filler particles | Sashi S. Kandanur, David Unruh | 2021-09-21 |
| 11107781 | RFIC having coaxial interconnect and molded layer | Rahul N. Manepalli, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing | 2021-08-31 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2021-08-24 |
| 11081448 | Embedded die microelectronic device with molded component | Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Sandeep Gaan | 2021-06-15 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Ying Wang +3 more | 2021-06-08 |
| 10998282 | Surface finishes for high density interconnect architectures | David Unruh | 2021-05-04 |
| 10897008 | Magnetoresistive stacks with an unpinned, fixed synthetic anti-ferromagnetic structure and methods of manufacturing thereof | Bengt J. Akerman, Renu Whig, Jason Janesky, Nicholas Rizzo, Jon Slaughter | 2021-01-19 |
| 10892219 | Molded embedded bridge for enhanced EMIB applications | Rahul N. Manepalli | 2021-01-12 |