Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more | 2021-04-20 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton | 2021-02-16 |