Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Weng Hong Teh, John S. Guzek, Robert L. Sankman | 2021-12-14 |
| 10985080 | Electronic package that includes lamination layer | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10957656 | Integrated circuit packages with patterned protective material | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more | 2021-03-23 |