Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, Weng Hong Teh, Robert L. Sankman | 2021-12-14 |
| 10930596 | Embedded die on interposer packages | — | 2021-02-23 |