Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, John S. Guzek, Robert L. Sankman | 2021-12-14 |
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2021-08-17 |