Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2021-08-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094604 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2021-08-17 |